STM and JESDAF respectively. A typical Human Body Model circuit is presented in Figure 1. Figure 1: Typical Human Body Model Circuit. In September , a small group of ESD control and design stakeholders assembled in a Read More». In the EERC Resource Center. A Dash of Maxwell’s. JESDAF. – IEC (C= pF). – MIL method Pulse parameters. HBM. Reference voltage. 2KV 4KV. Peak current. A A.
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ESD Tests | Reliability Technology Division | Services | OKI Engineering
All pins one at time to Vdd3 power pin group 6. It is permitted to use the same sample 3 at the next higher voltage stress level if all parts pass the failure criteria specified in clause 5 after ESD exposure to a specified voltage level.
This part of the slow decay shall be excluded in determining the trailing pulse magnitude. If you can provide input, please jezd22 this form and return to: ESD testing should begin at the lowest step in Table 1 but may begin at any level. Attach a shorting wire between these pins with the current probe around the shorting wire. Added third reference to table: For printed directions on Preparing for Registration.
Testing must be performed using an actual device chip. It is permitted to further partition each pin combination set in Table 2 and use a separate jssd22 of 3 devices for each subset within the pin combination set. Apply a positive and negative V pulse and verify the waveform meets the requirements a114ff in Table 1. Any pin that is connected to an internal power bus or a power pin a114 metal must be treated as a power pin example: The reference pin combination shall be identified by determining the socket pin with the shortest wiring path from the pulse generating circuit to the test socket.
Clarified that pin combination sets uesd22 be partitioned as far as necessary and performed on different devices to eliminate possible cumulative effects. Clause Description of change 4. In case the waveform no longer meets the limits in Table 1, all ESD testing performed after the previous satisfactory waveform check will be uesd22 invalid.
In the test sequences where this power pin group is held at ground Terminal Bit is permitted to have all the pins in the group tied together and connected to Terminal B or to have only the previously selected pin s connected to Terminal B with all other pins in the group left floating.
ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING HUMAN BODY MODEL (HBM) | JEDEC
Example of proposed changes being utilized Test Flow 1 HBM testing will be done in adherence to Table 2, with selected pin combinations replaced by alternative pin combinations.
Each Vdd2 pin Vdd2. Other suggestions for document improvement: Active discrete devices FETs, transistors, etc. Due to lack of specifications for this phenomenon, the magnitude of the resulting voltage rise at the stressed pin may vary significantly from tester to tester and can alter the behaviors of some ESD protection circuits.
It is permitted to use a separate sample of 3 devices for each pin combination set specified in Table 2. Otherwise each power pin must be treated as a separate power pin. The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint.
Any pin that is connected to an internal power bus or a power pin by metal must be treated as a power pin example: To provide better data reproducibility, it is permitted to place a shunt resistance between the pin to be stressed Terminal A and the system ground Terminal B in order to quench the pre-pulse phenomenon and eliminate the voltage rise as long as it does not alter the HBM waveforms as specified in Table 1 in tester qualification, calibration and waveform verification. The pin combination with the waveform closest to the limits see Table 1 shall be designated for waveform verification.
Added third reference to table: This tester issue was found to divert significant current away from the pins connected to Terminal B, such that the slew-rate of the current at terminal B is lower than seen at Terminal A. All pins which are not connected to the die shall be verified as such and left open floating at all times.
All pins one at time to Vdd1 power pin group 5. The other pins in the group do not need to be stressed.
Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. Longer intervals are still permitted. Example of proposed changes being utilized Test Flow 1 HBM testing will be done in adherence to Table 2, with selected pin combinations replaced by alternative pin combinations. This shunt resistance can be placed in the HBM simulator or in the test fixturing system.
Additionally, the system diagnostics test as defined in 3. Jes22 the current probe around the shorting wire.
The test devices shall be within the limits stated in the part drawing for these parameters. Any part that passes after exposure to an ESD pulse of V. This may require additional testing as each nonsupply pin must be treated as an individual power pin group.
The test devices shall be within the limits stated in the part drawing for these parameters. The high-voltage relays and associated high-voltage circuitry shall be tested by the user of computercontrolled systems per the equipment manufacturer’s instructions system diagnostics. Jexd22 ends of the wire may be ground to a point where clearance is needed to make contact on fine-pitch socket pins.
Any part that fails after exposure to an Jesdd22 pulse of V or less. Finer voltage steps may optionally be used to obtain a more accurate measure of the failure threshold.
Other suggestions for document improvement: When replacing only a single polarity of a given combination, the opposite polarity shall be used when adopting this reverse pin combination alternative.
Jesd222 a positive and negative V pulse and verify that the waveform meets the requirements defined in Table 1. Due to lack of specifications for this phenomenon, the magnitude of the resulting voltage jes2d2 at the stressed pin may vary significantly from tester to tester and can alter the behaviors of some ESD protection circuits.
Some punctuation changes are not included.
The probe transformer and cable with a nominal length of 1 meter shall have a 1 GHz bandwidth, a minimum current rating of 12 amperes peak pulse-current capability and a rise time of less than one nanosecond.